Wafer Bonding

HPO is the world-class professional manufacturer for optoelectronic semiconductor chip of full spectrum, vertical-structure LED chips, and holds the world's oldest light-emitting diode and single crystal substrate wafer-bonding patent. This key technology turns the original substrate into a silicon substrate after an MOCVD epitaxial growth process, giving LED chips exceptional thermal conductivity, and allowing them to provide even better light output efficacy under a high current and improve the component reliability.